Replacing laptop cpu

Tod Merley todbot88 at gmail.com
Sat May 23 17:38:22 UTC 2015


cmos battery

On Sat, May 23, 2015 at 10:21 AM, Dave Stevens <geek at uniserve.com> wrote:

> On Sat, 23 May 2015 11:03:31 -0600
> jd1008 <jd1008 at gmail.com> wrote:
>
> > I have an HP laptop with
> > AMD Turion II X2 mobile processor RM-72 / 2.1 GHz CPU, Socket S1.
> > It is now causing blue screens in windows and freezes
> > linux (pclinuxos, knoppix, fedora live).
> >
> > I have run the x86 mem test for more than a day, and
> > found no problems with the 4GB ram (2GB X 2).
> >
> > I am wondering why the memtest does not freeze????
> > could it be that only one core is causing the problem?
> >
> > At any rate I wanted to replace it with
> > AMD Turion II Ultra M660 TMM660DBO23GQ 2.7GHz Dual-Core Mobile CPU
> > Processor, Socket S1
> >
> >
> > Will I be running into any problems?
>
> have you tried reflashing the BIOS?
>
> D
>
> > Would the heat be an issue?
> >
> > These are the full technical data on it:
> >
> > General information
> >
> >
> > Type  CPU / Microprocessor
> > <http://www.cpu-world.com/CPUs/CPU.html> Market segment       Mobile
> > Family        AMD Turion II Ultra Dual-Core Mobile
> > <
> http://www.cpu-world.com/CPUs/K10/TYPE-Turion%20II%20Ultra%20Dual-Core%20Mobile.html
> >
> >
> > Model number  *M660
> > <
> http://www.cpu-world.com/CPUs/K10/AMD-Turion%20II%20Ultra%20Dual-Core%20Mobile%20M660%20-%20TMM660DBO23GQ.html
> >*
> >
> > CPU part number
> >
> >   * *TMM660DBO23GQ* is an OEM/tray microprocessor
> >
> > Stepping code         NAEIC AE
> > <http://www.cpu-world.com/step_codes/N/NAEIC%20AE.html>
> > *Frequency*   *2700 MHz*
> > *Bus speed*   *One 1800 MHz 16-bit HyperTransport link (3.6
> > GT/s)* *Clock multiplier*     *13.5*
> > Package       638-pin lidless organic micro Pin Grid Array (UOL638)
> > *Socket*      *Socket S1 (S1g3)*
> > Architecture / Microarchitecture
> >
> >
> > Microarchitecture     K10
> > Platform      Tigris
> > Processor core        Caspian
> > Core stepping DA-C2
> > CPUID         100F62
> > Manufacturing process         0.045 micron silicon-on-insulator (SOI)
> > technology *Data width*       *64 bit*
> > *The number of cores*         *2*
> > *The number of threads*       *2*
> > Floating Point Unit   Integrated, 128-bit wide
> > Level 1 cache size    2 x 64 KB 2-way set associative instruction
> > caches 2 x 64 KB 2-way set associative data caches
> > *Level 2 cache size*  *2 x 1 MB 16-way set associative caches*
> > *Level 3 cache size*  *None*
> > Multiprocessing       Uniprocessor
> > Features
> >
> >   * MMX instructions
> >   * Extensions to MMX
> >   * 3DNow! technology
> >   * Extensions to 3DNow!
> >   * SSE / Streaming SIMD Extensions
> >   * SSE2 / Streaming SIMD Extensions 2
> >   * SSE3 / Streaming SIMD Extensions 3
> >   * SSE4a
> >   * AMD64 / AMD 64-bit technology
> >   * EVP / Enhanced Virus Protection
> >   * AMD-V / AMD Virtualization technology
> >
> > Low power features    PowerNow! 2.0
> > Integrated peripherals / components
> >
> >
> > Integrated graphics   None
> > Memory controller     The number of controllers: 1
> > Memory channels: 2
> > Channel width (bits): 64
> > Supported memory: DDR2-800
> > Maximum memory bandwidth (GB/s): 12.8
> > Other peripherals     HyperTransport technology 3.0
> > Electrical / Thermal parameters
> >
> >
> > *Thermal Design Power*        *35 Watt*
> >
> >
>
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